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BOARD TO BOARD-B0501
BOARD TO BOARD-B0501
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Images are for reference only Please refer to product specifications
0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , MLAY Reel
B0501WVFD-S-2x45P-H36
Effective
EU RoHS Directive 2011/65/EU
EU ELV Directive 2000/53/EC
Product Subcategory
B0501Series
Product Pitch
0.50mm(.020in)
Material - Resin and Flammability
LCP UL94V-0
Plating
Gold (Au) Plating
Color - Resin
Natural
Plating thickness
1μin(0.025μm)
Drawing(PDF)
B0501WVFD-S-2xXP_dwg
download B0501WVFD-S-2xXP_dwg.pdf
Series Drawing(PDF)
Product Specification
Product type characteristics
Product Categories
BOARD TO BOARD
Pitch
0.50mm(.020in)
Product type
Header/Wafer
Lock structure
Without PCB Pegs
Product subcategory
B0501Series
Part Attribute
Header
Electrical characteristics
Voltage - Maximum(VAC/DC)
60
Current - Maximum per Contact(Max)(A)
0.5
Specifications and characteristics
Material - Resin and Flammability
LCP UL94V-0
Color - Resin
Natural
Material - Metal
Phosphor Bronze
Plating
Gold (Au) Plating
Plating thickness
1μin(0.025μm)
Structural characteristics
Number of Rows
2
Circuits
90
Mechanical characteristics
Orientation
Vertical
Panel mount
No
Termination Interface Style
SMD
PCB Polarity
Yes
Polarized plug-ins
Yes
Usage environment
Temperature Range - Operating
-40℃~105℃
Industry standard
UL
E326732
cUL
E326732
EU RoHS Directive 2011/65/EU
EU ELV Directive 2000/53/EC
China RoHS 2 Directive MIIT Order No 32, 2016
EU REACH Regulation (EC) No. 1907/2006
Disclaimer

This information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledge based on the information they provided. This information is subject to change. The part numbers that CJT has identified as EU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment products will be CE marked as required by Directive 2011/65/EU. Components may not be CE marked. Additionally, the part numbers that CJT has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulation, the information CJT provides on SVHC in articles for this part number is based on the latest European Chemicals Agency (ECHA) ‘Guidance on requirements for substances in articles’ posted at this URL: https://echa.europa.eu/guidance-documents/guidance-on-reach

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B0501WVMD-S-2x45P
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , Tape on Reel

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B0501WVMD-S-2x45P-G10
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B0501WVMD-S-2x45P-G15
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B0501WVMD-S-2x45P-G30
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 30μin(0.76μm) , , Tape on Reel

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B0501WVMD-S-2x45P-H43
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , Tape on Reel

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B0501WVMD-S-2x45P-H53
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , Tape on Reel

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B0501WVMD-S-2x45P
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , Tape on Reel

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B0501WVMD-S-2x45P-G10
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 10μin(0.253μm) , , Tape on Reel

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B0501WVMD-S-2x45P-G15
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 15μin(0.381μm) , , Tape on Reel

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B0501WVMD-S-2x45P-G30
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 30μin(0.76μm) , , Tape on Reel

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B0501WVMD-S-2x45P-H43
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , Tape on Reel

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B0501WVMD-S-2x45P-H53
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0.50mm(.020in)Pitch , Vertical , Header/Wafer , Dual , 90 Circuits , LCP UL94V-0 , Natural , 1μin(0.025μm) , Gold (Au) Plating , Tape on Reel

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